Semiconductors

Google hires veteran Apple chip architect to work on Pixel phones

Veteran Apple chip architect Manu Gulati is now a Lead SoC Architect at Google, reveals his LinkedIn profile which states that he started in his new Google role in May.

According to Variety, Gulati has been tasked with leading the effort to build highly optimized chips for Google's Pixel smartphones in-house.

He had been spearheading Apple’s own chip developments for close to eight years.

By hiring an industry expert, Google is hoping to distance itself from the rest of the pack. Like other flagship Android devices, Pixel smartphones use Qualcomm's Snapdragon 821 processor.

This makes it harder for Google to differentiate Pixel devices from other Android phones.

“In addition to Gulati’s hire, Google is now looking to hire additional chip experts to tightly control future Pixel hardware,” Variety learned from sources familiar with the hire.

A custom chip would allow Google to develop a more secure smartphone with better camera features, advanced biometric authentication, optimized power consumption and so forth.

iPhone 7, for example, is six times faster at image recognition than Google’s Pixel phone because its 64-bit A10 Fusion chip has a highly-optimized Image Signal Processor.

And with iOS 11, Apple is integrating features like Metal 2, machine learning and augmented reality directly into a phone’s main chip, which would have been impossible if the company hadn't closely controlled chip design.

For those wondering, Apple's Senior Vice President of Hardware Technologies, Johny Srouji, oversees the company's semiconductor and wireless teams, reporting directly to CEO Tim Cook.

“Johny has built one of the world’s strongest and most innovative teams of silicon and technology engineers, overseeing breakthrough custom silicon and hardware technologies including batteries, application processors, storage controllers, sensors silicon, display silicon and other chipsets across Apple’s entire product line,” according to his bio page on the Apple Leadership website.

Johny joined Apple in 2008 to lead development of the A4, the first Apple-designed system on a chip powering iPhone 4 and the original iPad.

Apple's semiconductor team is comprised of engineers who worked at startups like P.A. Semi that Apple acquired after releasing the original iPhone. Apple's logic was simple: it wanted to take its chip destiny into its own hands to tightly integrate the hardware and software, optimize device performance and power consumption and enable hardware features simply not possible on devices that use off-the-shel parts that are readily available to all vendors.

Incredibly, the strategy paid off big time.

Even the last-generation A9 processor inside iPhone 6s smokes competition in single-core performance, for instance. The A10 Fusion chip in the iPhone 7 family is even faster and Apple's latest chip, the A10X Fusion inside the new iPad Pros, features 30 percent faster CPU performance and forty percent faster graphics than the previous generation.

Samsung predicted to beat Intel, become #1 chip vendor this summer

Samsung's chip-making unit has been making some great strides in the past few years and now the South Korean chaebol is predicted to overtake Intel and become the world's top producer of computer chips. Should the prediction come true, this will be a major blow to Intel, which has been the leading chip maker in terms of sales for 26 years since 1991.

According to researchers with NH Investment & Securities, cited in a report by The Korea Herald, Samsung could overtake Intel as soon as this summer due to the rise in number of data centers and expanded demand of solid state drives.

Intel captured an estimated thirteen percent of global chip sales in the first quarter of 2016 versus Samsung's 9.1 percent share. But during the March quarter of 2017, Intel took up 14.7 percent while Samsung held a comparable figure of 13.4 percent.

“Starting the March-June period, Samsung's global market share of chips will surpass the 15-percent mark to outpace its rival, helped by its improved competitiveness in the memory segment,” the report added.

Apple no longer uses Samsung's chip fabrication plants to build its in-house designed processors for iOS devices, but iPhones and iPads still use Samsung-built flash memory modules and the iPhone 7's LTE modem is being dual-sourced from Intel and Samsung.

Apple hires Qualcomm Vice President to lead its wireless chip project

Apple has hired Esin Terzioglu, Qualcomm's Vice President of Engineering, to act as the project lead on its wireless system-on-a-chip project, suggesting the Cupertino company could be developing its own baseband modem for iPhone, iPad and iPod touch devices, reports AppleInsider.

Unlike Apple's in-house designed chips, Qualcomm's Snapdragon processors  and Samsung's own Exynos chips integrate the CPU, GPU and the LTE modem on the same chip package.

iPhone 7, for instance, uses dedicated LTE modems from both Intel and Qualcomm.

“After an amazing eight years at Qualcomm, it is time for me to move on to my next adventure,” Terzioglu shared the news via his LinkedIn account.

“I feel privileged for the opportunity to continue my career at Apple,” he added.

He is credit as an inventor of many Qualcomm patents.

After joining Qualcomm in August 2009, Terzioglu lead the Qualcomm CDMA Technologies Central Engineering organization. He has a Ph.D. in Electrical Engineering with a Ph.D. minor in Computer Science, both completed at Stanford University.

Apple and Qualcomm are currently embroiled in a $1 billion licensing dispute related to the royalty fees the iPhone maker and other companies pay to Qualcomm for its cellular chips.

According to Axios, the chip maker has asked a US court to force iPhone suppliers to keep paying it royalty fees, while it continues its legal battle with the Cupertino giant.

Intel unveils new Core X desktop processors, including flagship Core i9 chip

At Computex today, chip giant Intel unveiled a new Core X line of high-end processors for desktop computers. The new chips are mostly based on an updated version of Intel's sixth-generation Skylake platform, called Skylake X, with the exception of a pair of entry-level four-core models that are based on the Kaby Lake X platform.

Billed as Intel's most scalable, accessible and powerful desktop platform ever, the lineup includes a new Core i9 processor brand along with a Core i9 Extreme Edition processor—the first consumer desktop chip with a whopping 18 cores and 36 threads of power.

Intel's Turbo Boost technology has been updated with Turbo Boost Max 3.0 technology as well.

According to Intel, the new Core X family sports ten percent faster multithread performance over the previous generation, and a 15 percent boost in single thread performance.

The entry-level Core X i5-7640X chip with four cores and as many threads starts at $242.

The more powerful Core i7 X-Series starts at $339 for a four-core, eight-thread model and goes all the way up to a $599 eight-core, 16-thread chip.

The flagship Core i9 X-Series chip, which stars at ten processor cores and 16 threads, is priced at $999, with its 16-core, 32-thread variant going for $1,699.

The new desktop Core X chips are designed to work with Intel’s new X299 motherboard chipset which should be rolling out on partner products in the coming weeks, along with the new CPUs.

As you know, Apple is expected to update its iMac all-in-ones with server-grade Intel Xeon processors and discreet graphics later this year.

The chip giant says its upcoming eighth-generation Coffe Lake platform will see up to a thirty percent performance improvement over the current seventh-generation Kaby Lake.

It did not provide a timeframe for Coffe Lake chips. “We will have more to say about the eightht-generaiton Core processor in the future,” said Intel.

The Coffe Lake chips may power updated MacBook Pros, coming later this year.

In time for iPhone 9, TSMC’s 7nm tech moving to volume production in 2018

Chip foundry Taiwan Semiconductor Manufacturing Company (TSMC), which counts Apple as its biggest client, is ready to move its cutting-edge seven-nanometer process technology to volume production in 2018.

According to DigiTimes, an improved version of TSMC's seven-nanometer process using extreme ultraviolet technology will be ready for volume production in 2018, according to company co-CEO CC Wei.

The firm's five-nanometer node is slated to enter risk production in 2019, Wei added.

TSMC currently makes A10 chips for iPhone 7 and is said to be exclusively churning out the upcoming Apple-designed A11 processors for iPhone 8 and other 2017 iOS devices.

TSMC in April reportedly began stockpiling A11 chips for 2017 iPhones.

The firm should step up its pace of inventory building from June onward, said industry sources.

iPhone 8's A11 system-on-a-chip should be built on TSMC's ten-nanometer process technology, yielding faster performance and lower power consumption.

The A11 Fusion chip inside iPhone 7 is being manufactured on TSMC's 16-nanometer node.

Apple is building a brand new chip dedicated to artificial intelligence and machine learning, Bloomberg said recently, but it's unclear if the new chip will make its way into iPhone 8.

Thunderbolt 3 to go royalty-free by 2018

Intel announced today it will be making Thunderbolt 3 royalty-free for manufacturers in 2018 to boost adoption. Moreover, the chip giant will be natively integrating Thunderbolt 3 into its future CPUs, which should help reduce the overall solution cost on the computer.

“We think the first thing is going to drive broader adoption and deployment of Thunderbolt 3 in PCs,” Jason Ziller, Intel’s lead for Thunderbolt development, told Wired. “The second will drive also broader adoption in the ecosystem, with a lot of different peripherals and other devices.”

Intel is continually working with the industry to lower the cost of the cables and the devices. The improving USB-C economies of scale should help Thunderbolt 3 drive down costs.

There are currently about 60 Thunderbolt-compatible peripherals.

About 180 seventh-generation Core CPUs from Intel include native Thunderbolt 3 integration, with another 30 or so expected by the end of the year.

Dan Riccio, Apple’s Senior Vice President of Hardware Engineering, said:

Apple and Intel have collaborated on Thunderbolt from the beginning, and as the industry leader in its adoption, we applaud Intel’s efforts to integrate Thunderbolt technology into its CPUs and open it up to the rest of the industry.

The Thunderbolt protocol has been struggling to gain traction.

Jointly developed by Apple and Intel six years ago, it's failed to go mainstream due to the royalty fees vendors are required to pay and a combination of high cost and low availability.

Thunderbolt 3 supports data speeds of up to 40 Gbps, allowing you to transfer a 4K movie in about thirty seconds. In addition to data, the protocol allows for power, USB, DisplayPort, HDMI and VGA to be carried over a single reversible port that's compatible with USB-C.

“There always have been and probably will continue to be some wired ports on even the thinnest and lightest computers,” says Ziller. “So having a single port that really do everything that you need is our vision for Thunderbolt 3.”

Apple's MacBook Pro uses a dedicated Thunderbolt 3 controller measuring 10.7mm × 10.7mm.

Microsoft has enhanced Thunderbolt 3 device plug-and-play support in the now available Windows 10 Creators Update, with additional enhancements planned for future OS releases.

By integrating the protocol into its CPUs and making the Thunderbolt specification available to third-party chipmakers royalty-free next year should help Thunderbolt 3 become an industry-standard it was always meant to become.

TSMC resolves manufacturing woes, kicks off production of A11 chips for upcoming iPhones and iPads

Taiwan Semiconductor Manufacturing Company (TSMC) has commenced production of Apple-designed A11 chips for upcoming iPhones and iPads.

According to a report Thursday from Taiwanese trade publication DigiTimes, the semiconductor foundry has successfully resolved initial manufacturing issues in the company's ten-nanometer FinFET process technology.

“TSMC has begun 10nm chip production for Apple's next-generation iPhone 8 series,” sources told the publication. “Production was once affected by issues involving stacking components in the backend integrated fan-out packaging process, but they have already been solved.”

TSMC is Apple's exclusive manufacturer of the in-house designed 16-nanometer A10 Fusion chip for the iPhone 7 series. TSMC's new ten-nanometer process should yield smaller chips that run faster and consume less energy.

TSMC has also secured 12-nanometer chip orders (a smaller version of its 16nm technology) from Nvidia, MediaTek, Silicon Motion Technology and HiSilicon. As for TSMC's 10nm process, the node technology has obtained orders from Apple, MediaTek and HiSilicon, as per sources.

Toshiba warns Western Digital not to interfere in sale of its lucrative chip unit

Reuters reported Tuesday that Toshiba has now formally warned Western Digital not to interfere in the sale of its semiconductor unit. This follows recent reports that the US-based storage maker held talks with the iPhone maker regarding a potential acquisition of the Japanese giant's highly lucrative NAND flash chip business.

This is interesting because the two companies jointly operate Toshiba's main semiconductor plant. Western Digital accused Toshiba of violating their contract by transferring their joint venture's rights to the newly formed unit, which Toshiba denied.

The Japanese giant is now threatening legal action.

Western Digital's “campaign constitutes intentional interference with Toshiba's prospective economic advantage and current contracts,” reads Toshiba's letter.

“It is improper, and it must stop,” it added.

After Toshiba narrowed the list of bidders to Western Digital’s rivals, the US firm has formally complained to Toshiba because it felt the Japanese conglomerate should negotiate with it first.

Wester Digital even asked for exclusive negotiating rights.

Western Digital is not seen as a favored bidder for Toshiba's chip business because it put in a much lower offer than other suitors, sources with knowledge of the matter have said.

Toshiba is the world's second biggest NAND chip producer.

Among other suitors, technology giants such as Apple’s contract manufacturer Foxconn, flash memory chip maker SK Hynix and wireless chip maker Broadcom are said to be interested in investing into Toshiba's semiconductor business.

Western Digital held talks with Apple regarding acquiring Toshiba’s chip business

Toshiba has narrowed the list of bidders for its lucrative semiconductor business to a small group that includes Western Digital’s rivals such as Apple's favorite contract manufacturer Foxconn, memory chip maker SK Hynix and wireless chip maker Broadcom. Western Digital, however, feels that Toshiba should negotiate with it first.

In a new Bloomberg report Thursday, Western Digital has confirmed it's currently in talks with Japanese government-backed investment funds regarding a potential deal with the Japanese conglomerate. Mark Long, Western Digital's CEO, hinted that his company has held discussions with Apple as it tries to win a battle for Toshiba’s flash memory unit.

Apple to slash royalty payments to GPU designer Imagination by two-thirds

As Apple is winding down its supply deal with UK-based GPU designer Imagination Technologies over the next two years, a new report alleges that the Cupertino firm is about to slash payments to Imagination to just one-third of its current royalty rate.

Reuters cited UBS analysts as predicting that Imagination could very easily become a loss-making company by fiscal 2019 without any Apple royalty contributions. The British GPU designer may even have to axe jobs and consider other potential cost-cutting moves in order to weather the storm ahead.

Apple suppliers prepping to stockpile A11 chips for upcoming iPhones

Quarterly chip demand for iPhone is predicted to surpass 50 million units in the second half of this year as Apple begins to stockpile next-generation processors and other chips for 2017 iPhones, trade publication DigiTimes said Wednesday. Chip orders should hit a total of between 220 million and 230 million units between the end of the second quarter and the beginning of the third. This implies strong projected demand for the OLED-based iPhone 8 and the iterative LCD-based iPhone 7s and iPhone 7s Plus updates.

iPhone modem supplier Qualcomm countersues Apple

iPhone modem supplier Qualcomm is countersuing Apple in the U.S. District Court for the Southern District of California, saying the Cupertino company could not have “built the incredible iPhone franchise” without its fundamental cellular technologies. The chip maker accused Apple of contributing “virtually nothing” to the development of core cellular technologies.